

Price:
Minimum Order Quantity : 100 Units
Material : Epoxy, Silicon, Plastic for enclosure
Weight : 3.5 g
Insulation Material : Plastic Molded Body
Dimension (L*W*H) : 10.2 x 7.5 x 4.5 mm (typical package size)
Connector Type : PCB Pin
Minimum Order Quantity : 100 Units
Material : Plastic/Epoxy Body with Metal Pins
Weight : 2.5 g (approx)
Insulation Material : Epoxy Molded
Dimension (L*W*H) : Standard IC packaging, e.g. 10.16mm 6.4mm 4.57mm (DIP8)
Connector Type : Pin
Minimum Order Quantity : 100 Units
Material : Plastic, Metal
Weight : 6g
Insulation Material : Plastic Epoxy
Dimension (L*W*H) : 10.6mm x 4.5mm x 8.3mm
Connector Type : Solder Pin
Minimum Order Quantity : 500 Units
Material : Plastic (epoxy molded package), silicon die
Weight : 2 g (approx) per IC
Insulation Material : Molded plastic (package body)
Dimension (L*W*H) : Standard DIP8/DIP14: approx. 19mm x 7mm x 4mm (IC dependent)
Connector Type : IC pins (socket, solder mount)